BondsWhat's this?
Price (HKD)
- -% (-)
14JS2.27% NTS 05/02/21
Track 29 more instruments
Open / Last close
- / -
High / Low
- / -
Bid / Offer
- / -
Maturity Date
05.02.21
As at 19.01.21 12:19:28 - All data delayed at least 15 minutes
29 more instruments

MITSUBISHI CORPORATION FINANCE PLC instruments

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Bonds (30)
Code Instrument name Price Maturity Type Documentation
14JS2.27% NTS 05/02/21-
HKD
05.02.21Bonds-
10HE2.566% NTS 28/11/22-
USD
28.11.22Bonds-
14RLCALL STEP-UP NTS 25/09/30-
JPY
25.09.30Bonds-
15OP2.55% NTS 26/01/23-
HKD
26.01.23Bonds-
16MISTP UP FXD RTE NTS 25/10/23-
JPY
25.10.23Bonds-
17NXFLTG RTE NTS 24/06/24-
USD
24.06.24Bonds-
17OU2.90% NTS 14/02/23-
USD
14.02.23Bonds-
17RJSTEP UP CALL FXD RTE NTS 11/12/23-
JPY
11.12.23Bonds-
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As at 19.01.21 12:19:28 - All data delayed at least 15 minutes

Instrument information

What's this?
Market
PSM
 Admission date
05 February 2016
 Maturity date
05 February 2021
 Amount issued (m)
80,000,000.00
 Coupon rate
-
 Coupon type
-
 Coupon frequency
-
 Expected next coupon payment date*
-
 Yield to maturity
-
 ISIN
XS1356741766
 SEDOL
BZCTDX3
 Market identifier code (MIC)
XLOM
 Trading service
Fixed interest (Trade reporting Only)
 Market segment
CWTU
For Bonds - Issue date is for indicative purposes only. For exact dates please refer to bond documentation directly.

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